NATIONAL E&E FORUM 2024

Monday, 25 November 2024 | 8:30 AM - 1 PM (GMT +8)

HILTON KUALA LUMPUR, Sentral Ballroom A & B

Organized by Malaysia Semiconductor Industry Association

Supported by Malaysia Productivity Corporation

Supported by Electrical & Electronics Productivity Nexus

Semiconductor As A Catalyst For The Malaysia Economy

Monday, 25 November 2024, 
Hilton Kuala Lumpur,
Sentral Ballroom A & B

The MSIA National E&E Forum 2024 is back and set to be a groundbreaking event for the semiconductor industry, bringing together experts, innovators, and enthusiasts from around the world. With a focus on cutting-edge technology and electronic components, this forum promises to be a hub for knowledge exchange and collaboration. Participants can expect engaging discussions, insightful presentations, and networking opportunities that will shape the future of the semiconductor field.

Days
Hours
Minutes

To MSIA National E&E Forum 2024 

Hilton Kuala Lumpur
Sentral Ballroom A & B

Monday, 25 November 2024

8:30am - 1pm

The National E&E Forum 2024 will provide a comprehensive exploration of the semiconductor industry’s pivotal role in driving the Malaysian economy. Featuring keynote sessions and three insightful panels, the forum will bring together thought leaders and experts to address critical advancements and challenges shaping the industry.

Key topics include strategies for advancing IC design with speakers from leading tech and semiconductor companies who will share real-world experiences and lessons on moving up the value chain. A panel on the transformative impact of AI, featuring leaders AI, cloud-computing, software and hardware companies will delve into how AI is revolutionizing various sectors, reshaping industries, and raising questions about responsible innovation. Finally, experts will discuss the future of semiconductor manufacturing through advanced packaging technologies, revealing how these innovations support the continued scaling of Moore’s Law and redefine manufacturing capabilities.

This forum offers attendees a deep dive into the technologies and strategies essential to the semiconductor sector’s role as a catalyst for Malaysia economic transformation.

 

The E&E Event of the Year

Program

This section is currently being updated and subject to change.

8:00am

Registration

Ms. Nurul Nadia Zainal Adnan,
Assistant Manager, Malaysia Productivity Corporation (MPC)

8:30am

Welcome by Emcee

Ms. Nurul Nadia Zainal Adnan,
Assistant Manager, Malaysia Productivity Corporation (MPC)

8:35am

Introductory Speech

Ybhg Dato’ Seri Wong Siew Hai
President, Malaysia Semiconductor Industry Association (MSIA)

8:45am

Keynote Speech

The Importance of the national semiconductor strategy (NSS) towards The Malaysia Economy

Exploring the pivotal role of semiconductors in driving Malaysia’s economy. And highlighting how these technologies underpin advancements like 5G and AI, and how public-private collaboration can strengthen Malaysia’s position in the global semiconductor landscape, fuel innovation and economic growth.

YB Liew Chin Tong
Deputy Minister, Ministry of Investment, Trade and Industry (MITI)

9:00am

Signed MOU Exchange Ceremony

Collaboration on Malaysia's First Locally Developed and Manufactured Edge Al System

SkyeChip Sdn Bhd | Elliance Sdn Bhd | Kaltech Sdn Bhd | Estek Automation Sdn Bhd

9:30am

Networking Break

9:45am

Keynote Presentation

The Future of IC Design - Trends, Challenges & Opportunities

Exploring how integrated circuit (IC) design is evolving to meet the demands of today’s high-tech applications. The presentation will cover emerging trends, key design challenges, and unique opportunities for Malaysia’s semiconductor sector, offering insights into how the industry can capitalize on these advancements to drive growth and innovation

10:00am

Panel Discussion 1: IC Design

Strategies to move up the value chain - areas of opportunities & lessons of success & failures

The discussion will delve into strategies for advancing within the integrated circuit (IC) design industry, pinpointing growth opportunities, and sharing real-world insights from both successful and challenging experiences. Panelists will discuss the evolving landscape of IC design and provide valuable perspectives on how companies can enhance competitiveness and drive innovation on a global scale.

Moderator

Keat Yap
Senior Partner, Kearney

Panelists

David Hsu
FAE Director, Arm Taiwan

SK Fong
Chief Executive Officer, SkyeChip

Suresh Kumar Dass
VP, Design Engineering and GM, Intel Malaysia Design Center

 

11:00am

Panel Discussion 2: AI

How is Al revolutionizing the world?

Industry experts will explore the transformative impact of artificial intelligence (AI) in various sectors. The panel will discuss innovative AI applications, the challenges of implementation, and the ethical considerations surrounding this technology. Attendees will gain insights into how AI is reshaping industries, driving efficiency, and creating new opportunities for businesses and society alike, while also addressing the future of work and the importance of responsible AI development.

Moderator

Dr. James Ong
Founder and MD of Artificial Intelligence International Institute (AIII) and Adjunct Professor, Singapore University of Technology and Design (SUTD) & AI Mega Centre

Panelists

Catherine Lian
Vice President & Executive Technology Leader, IBM ASEAN

Sathvik Rao
Managing Director, Accenture Industry X

Dr. Andrew Lau
Director of Strategic Programs, Microsoft Malaysia

 

12:00pm

Panel Discussion 3: Advanced Packaging

How AP will scale Moore's law & transform semiconductor manufacturing

In this forward-looking panel experts will examine how breakthroughs in advanced packaging are enabling the continued scaling of Moore’s Law. Panelists will discuss innovative packaging techniques that enhance performance and efficiency, as well as their impact on semiconductor manufacturing. Gain insights into how these advancements are reshaping the production landscape, supporting the demand for powerful, compact technologies, and driving new possibilities for the future of the industry.

Moderator

Dr. Tan Chun Sheng
Group Vice President & General Manager Muar, STMicroelectronics



Panelists

Dr. Yik Yee Tan
Senior Technology & Market Analyst, Semiconductor Packaging, YOLE Group

Dr. Eu Poh Leng
Senior Director of External Package Innovation, Package Innovation, Chief Technology Office, NXP Semiconductor

Ooi Teng Chow
Sr Director, Advanced Packaging Program Office, Intel.

Lee Chee Ping
Senior Director, Technologist & Technical Marketing, Lam Research

 

1:00pm

Adjourn

Speakers, Panelists and Moderators

Click on speaker’s image to read their bios.

YB Liew Chin Tong


Deputy Minister
Ministry of Investment, Trade and Industry

Ybhg Dato' Seri Wong Siew Hai

President
Malaysian Semiconductor Industry Association (MSIA)

Keat Yap

Senior Partner
Kearney

David Hsu


FAE Director
Arm Taiwan

SK Fong

Chief Executive Officer
SkyeChip

Suresh Kumar Dass

VP, Design Engineering and GM, Intel Malaysia Design Center
Intel Corporation

Dr. James Ong

Founder & Managing Director
Founder and MD of Artificial Intelligence International Institute (AIII) and Adjunct Professor, Singapore University of Technology and Design (SUTD) & AI Mega Centre

Catherine Lian

Vice President & Executive Technology Leader
IBM ASEAN

Sathvik Rao

Digital Engineering & Manufacturing Lead (SEA)
Accenture

Dr. Andrew Lau

Director of Strategic Programs
Microsoft Malaysia

Dr. Tan Chun Sheng

Group Vice President & General Manager Muar
STMicroelectronics

Dr. Yik Yee Tan

Senior Technology & Market Analyst, Semiconductor Packaging
YOLE Group

Dr. Eu Poh Leng

Senior Director of External Package Innovation, Package Innovation, Chief Technology Office
NXP Semiconductor

Ooi Teng Chow

Sr Director, Advanced Packaging Program Office Intel

Lee Chee Ping

Senior Director, Technologist & Technical Marketing
Lam Research

xxx


xxx
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Who Should Attend

Semiconductor companies including

  • Existing players in Malaysia (Multi-Nationals, Malaysian)
  • Potential investors into Malaysia
  • Service Providers (including Investment Analysts, Consultants, Banks)
  • Foreign Chambers of Commerce
  • Investment promotion Agencies
  • Other relevant industry associations
 
 This forum is a free event for all members of MSIA. Seats are limited – reserve your free seat now. Tickets are limited to 1 pax per company.

EVENT SPONSORSHIP OPPORTUNITIES

Showcase Your Company! Magnify Your Audience & Brand

Maximize your company’s visibility and strengthen brand equity by sponsoring this event. 

If you would like to sponsor this event, contact us to learn more! Sponsorship submission closes on Monday, 11 Nov 2024. 

Registration

This forum is a free event and registration is open to all members of MSIA. Seats are limited – reserve your free seat now.

Tickets are limited to 1 pax per company.

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Venue

Hilton Kuala Lumpur

Sentral Ballroom A & B,
Hilton Kuala Lumpur
3, Jalan Stesen Sentral,
Kuala Lumpur Sentral,
50470 KL

Contact us

Malaysia Semiconductor Industry Association (MSIA)

Malaysia Productivity Corporation Northern Region Office,
Beg Berkunci 206, Jalan Tun Hamdan Sheikh Tahir,
13200 Kepala Batas, Seberang Perai Utara, Penang.

© 2021 All rights reserved. Malaysia Semiconductor Industry Association. Powered by Karma & FTF Creators Studio

RESERVE YOUR SEAT TODAY!

Ybhg Dato Seri Wong Siew Hai

President, Malaysia Semiconductor Industry Association

Dato’ Seri Wong is a member of Pemudah, a public – private sector special task force to facilitate business and improve Malaysia’s global competitiveness.
 
Dato’ Seri Wong served with Intel for 27 years. His last position with Intel was Vice President of Technology and Manufacturing Group (TMG) and General Manager of Assembly and Test Manufacturing (ATM), responsible for all assembly test factories worldwide. 

Keat Yap

Senior Partner, Kearney

Keat Yap is a Senior Partner at Kearney and APAC Co-Lead for Strategic Operations, based in the Kuala Lumpur office. He has over two decades of global industry and management consulting experience helping companies to achieve business and operations excellence.

Keat’s expertise spans multiple industries, including high tech/ semicon, automotive, utilities, banking, consumer products, and government. He specializes in E2E supply chain improvement, operations excellence, manufacturing, IT, semicon technology development, and strategic customer manufacturing enabling.

Keat’s recent work has helped his clients successfully across a wide range of initiatives, including building resilient supply chains, procurement digitalization strategy, and large-scale business operations transformation. He is also a regular speaker at industry-leading events including Semicon SEA.

David Hsu

FAE Director, Arm Taiwan

David Hsu is FAE Director of Arm, leading FAE team of Taiwan for closer collaboration and communications internally and externally to accomplish partners and customers solutions. He has over 20 years of professional experience in the semiconductor industry.

David Hsu joined Arm in 2011 as a CPU FAE as well as responsible for product marketing and sales project management and then left in 2017. After then, he joined Intelligo, a start-up invested by MediaTek, leading the business development team to explore opportunities in Japan, Korea, and US. 

In 2019 David was recruited by Arm again as FAE director to drive Arm’s IP solutions adoption.

In addition to Arm, David worked at Faraday, Alpha Imaging Technology (MediaTek subsidiary) and BenQ, focusing on IC design work ranging from architecture definition, RTL coding, front-end/back-end implementation to IC verification and testing. He has rich experience in pre-sales strategy set-up
and sales enablement. David received a master’s degree in Computer Science and Engineering at
National Chiao Tung University.

SK Fong

Chief Executive Officer, SkyeChip

Swee Kiang (SK) Fong (鄺瑞强) has more than 30 years of experience in semiconductor industry.

He started his career and worked in Intel for more than 20 years on various technical and management positions in US and Malaysia. He was instrumental in starting up Intel Design Center in Malaysia and growing the organization to 1500 people responsible for microprocessor, Chipset, SOC design and development. He then joined Altera Corporation as VP of R&D, leading the development of advanced FPGA, IP and Quartus software in Malaysia.

He was the senior director of Broadcom Corporation overseeing the global operation of a USD1B division before starting up SkyeChip.

Suresh Kumar Dass

Vice President and General Manager of Malaysia Design Center, Intel Corporation

Suresh is Vice President and General Manager of Intel’s Malaysia Design Center, the largest semiconductor Design & Development Center in Southeast Asia. Besides driving the development of advanced Integrated Circuits (IC) design, he collaborates extensively with the external ecosystem – universities, government, and industry partners to drive the application of innovative technologies for the greater good. He has been passionately driving the integration of Diversity, Equity & Inclusion (DEI) and Environmental Social Governance (ESG) best practises in all aspects of the Design Center’s operations.

Dr. James Ong

Founder & Managing Director, Founder and MD of Artificial Intelligence International Institute (AIII) and Adjunct Professor, Singapore University of Technology and Design (SUTD) & AI Mega Centre

Dr. James Ong founded Artificial Intelligence International Institute (AIII), a think tank advocating Sustainable AI for Humanity and is co-author of AI for Humanity: Building A Sustainable AI for the Future, published by Wiley. 

With 38+ years of industry experience, he is Adjunct Professor at SUTD and AI Mega Centre, a member of Strategic Resource Allocation Committee at National Supercomputing Centre Singapore, Head of AI at Global Fintech Institute, CEO of Origami Frontiers venture building firm and Venture Partner at Delight Capital. He received his PhD from the University of Texas at Austin specializing in AI for Governance.

Catherine Lian

Vice President & Executive Technology Leader, IBM ASEAN

Ms Catherine Lian was appointed as Managing Director for IBM in Malaysia in 2019. In this role, she is responsible for all strategic and operational matters related to IBM’s sales, services, and delivery operations in Malaysia. 

Catherine leads the IBM Malaysia team to help key stakeholders and clients put smart to work in their organisations by applying IBM’s leading AI, cognitive solutions, and cloud platform to advance digital transformation. 

In January 2024, Catherine assumed the role as the Vice President & Executive Technology Leader for the ASEAN Region. In this role, Catherine is responsible for all strategic and sales operational matters across 6 Countries in Malaysia, Singapore, Thailand, Indonesia, Vietnam and Philippines.

Catherine’s stint with leadership roles in the IT Industry began at Dell Technologies, where she worked for the past two decades before joining IBM Malaysia. Her last role was the Senior Director & Managing Director for Dell Indonesia, based in Jakarta. She has also held various management roles within Dell Technologies, covering the South Asia markets, including Malaysia, Sri Lanka, Bangladesh, Indochina, and Cambodia. Throughout her career, Catherine has been consistently recognised as the key leader in the IT industry, helping and enabling clients to innovate and succeed.

Catherine is a strong advocate for women in leadership in the IT Industry and was recognised at the Channel Asia Women in ICT Awards 2020 as the Highly Commended winner under the Achievement Category in the ASEAN region. She continues to mentor aspiring talents, believing that by leading the way, aspirants are empowered to create thriving and sustainable communities.

Catherine has been appointed as the PIKOM (The National Tech Association of Malaysia) Councillor in 2021. She has since held key positions in the association, including Chairman for Women in Tech 2022, Chairman for Tech Fest 2022 and Deputy Chairman for IR 4.0 SIG 2022.
This year, Prestige Magazine Malaysia has recognised Catherine as one of the 100 nation’s most influential Women of Power.

Recently, she is also recognised as the winner of Channel Asia Women in ICT Awards under the Achievement category. Catherine won this award in recognition of a management career spanning more than two decades in Malaysia and South Asia, built on the foundations of business growth, customer success and individual mentoring.

Sathvik Rao

Digital Engineering & Manufacturing Lead (SEA), Accenture

Sathvik Rao is a seasoned expert with over 18 years of experience in consulting, solution design, and digital transformation for asset-reliant industries across the APAC region. As the Digital Engineering & Manufacturing Lead at Accenture Southeast Asia, he has spearheaded initiatives in smart manufacturing, IT-OT integration, and engineering data management, delivering impactful solutions that drive productivity and operational efficiency. His expertise spans engineering and R&D systems, digital twins, advanced analytics, and enterprise architecture, and he has served in pivotal roles as Solution Architect, Enterprise Architect, and Delivery Lead on major transformation projects.

A thought leader and keynote speaker in Industrial IoT and industrial data analytics, Sathvik also mentors startups and actively contributes to industry standards and practices. He serves as a Leadership Council Member at the Singapore Industrial Automation Association and is a member of the Manufacturing Standards Committee under Enterprise Singapore, where he collaborates on initiatives to support industry innovation and resilience. His leadership and technical acumen make him a prominent figure in the drive to enhance industrial performance through digital technologies.

Dr. Andrew Lau

Director of Strategic Programs, Microsoft Malaysia

Andrew Lau is a Director of Strategic Programs for Microsoft in Malaysia, where he is tasked to support business imperatives of leading enterprises and the maturing digital initiatives that are of national priority in Malaysia.

His key responsibilities include driving successful customer outcomes, delivering business value through innovation, as well as helping companies and governments digitally transform to deliver impact. In addition, he establishes partnership with both public and private enterprises to drive digital resilience and AI innovations in Malaysia. As an end goal, he takes charge to ensure customers, the government, and partners get the best of their technological investments and experience to improve how they work.

Andrew has over 20 years of working experience in the Telco and IT industry, with exposure across Asia Pacific and Japan regions. In those 20 years, he has held leadership positions in HP and Agilent Technologies. Prior to joining Microsoft, he was the General Manager for Cloud Platforms at Oracle Malaysia.

Since joining Microsoft in 2018, Andrew has leveraged his strong track record and experience across cloud platforms and consulting services to help Microsoft lead the business transformation dialogue in Malaysia. He is also a regular speaker on public forums in the areas of digital resilience, datacenters, sustainability, and AI.

He holds a Doctor of Philosophy in Electrical Engineering and Bachelor of Science in Electrical & Electronics Engineering from the University of London. Outside of work, he enjoys taking long hikes and travelling with his family.

Dr. Tan Chun Sheng

Group Vice President & General Manager Muar, STMicroelectronics

CS Tan is the Group Vice President & General Manager for STMicroelectronics Muar and has held this position since joining the Company in 2013.

In his tenure, the ST Muar back-end plant has grown to be ST’s largest in terms of space, with an expanded range of technologies including advanced packages. In 2019, the ST Muar back-end plant received the Industry Excellence Award from Malaysia’s Prime Minister and was also recognized as a Lean Gold plant by the Malaysia Productivity Corporation.

CS started his career with National Semiconductor Penang and has an illustrious career spanning 32 years covering industries such as Semiconductor, Hard Disk Storage, and Electronics Manufacturing Services. His most recent appointments include General Manager of large MNC factories such as Flextronics and ON Semiconductor. Throughout his career, CS led various important manufacturing initiatives such as Lean Manufacturing, Total Quality Management, Reliability Centered Maintenance and more recently Industry 4.0 (Connected Manufacturing). 

CS Tan was born in Penang, Malaysia in, and graduated with 1st Class Honours degree in Applied Physics from USM and subsequently obtained MBA with USM. He was also recently appointed as Adjunct Professor to the Faculty of Electrical and Electronics Engineering in UTEM, Melaka and was recently awarded Honorary Doctor of Engineering by UTEM.

Dr. Yik Yee Tan

Senior Technology & Market Analyst, Semiconductor Packaging, YOLE Group

Dr. Tan Yik-Yee is a Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group, within the Semiconductor Manufacturing & Global Supply Chain Business Line. 

Yik Yee Tan holds a Ph.D. in Engineering from Multimedia University (MMU, Malaysia). She has more than 25 years of experience in semiconductor packaging. Based on her technical expertise and market knowledge, she develops technology & market reports and is engaged in dedicated custom projects. Prior to Yole, Yik Yee Tan worked as a failure analyst and interconnect principal at Infineon Technologies (Malaysia) and later as an open innovation senior manager at Onsemi (Malaysia). 

While at Onsemi, Yik Yee was deeply involved in numerous innovative advanced packaging projects. She published more than 30 papers and hold 3 patents.

Dr. Eu Poh Leng

Senior Director of External Package Innovation, Package Innovation, Chief Technology Office, NXP Semiconductor

Dr. Eu Poh Leng has been with Motorola/Freescale/NXP Semiconductors Malaysia for 27 years and has been very actively involved in the development and introduction of new technology and new product in internal and external factories. She currently leads a team of engineers and site managers, who drive all NTI/NPI development of NXP products with various OSATs around the globe.

She has published 74 technical papers and 4 journals externally and owns 24 filed and 11 issued patents. She is recognized as one of the Notable Inventors in NXP.

Dr. Eu is also Chair of IEEE-EPS for Malaysia Chapter from Y2023-2024, and the recipient of IEEE Malaysia Women in Engineering Award on July 6th, 2024.

Dr. Eu has 27 years in semiconductor industry and published 74 technical papers and 4 journals. She owns 23 filed and 11 issued patents.

 

Ooi Teng Chow

Sr Director, Advanced Packaging Program Office, Intel.

Teng Chow joined Intel Disaggregation Manufacturing Operations in 2021 as the Senior Director of the Program Office. In his role, his is responsible for overlooking the start-up of the Advanced Packaging Factory from design review, hiring, supplier readiness, technology transfer to factory operations.

As an industry veteran, Teng Chow has more than 20 years of various experience including FPGA and ASIC IC design, lead Product Test Development engineering and lead automotive qualification for generations of FPGA products. Teng Chow holds a bachelor’s degree on EE engineering from University of Technology Malaysia.

Lee Chee Ping

Senior Director, Technologist & Technical Marketing, Lam Research

Lee Chee Ping is the Technical Director from Lam Research, focusing on the heterogeneous integration segment. He has more than 20 years of experience in semiconductor industry, of which 14 years are related to advanced packaging. He has led worldwide field process teams and worked closely with customers on various 2D/2.5D/3D technologies development and qualification. He also engages the microelectronics ecosystem from universities, fabless players, IDMs, OSATs to equipment & material suppliers on technical exchanges and collaborations.

In view of his deep understanding of this segment, Chee Ping now oversees advanced packaging market analysis and technology trends mapping, along with technical marketing of Lam’s wafer & panel level equipment solutions. He is a regular speaker at various semiconductor advanced packaging conferences worldwide.

Chee Ping received his M.Eng in Technology Management from the University of South Australia, as well as both M.Sc in Financial Engineering and B.Eng in Chemical Engineering from National University of Singapore.

Clark Tseng

Senior Director, Market Intelligence Team, SEMI

Clark Tseng is the Senior Director of the Market Intelligent Team (MIT) at SEMI. In this role, he is responsible for leading SEMI’s global market research team that tracks and analyzes the dynamics of the semiconductor manufacturing supply chain. Clark has extensive experience and expertise in analyzing and forecasting various microelectronics industries, including IDM, Fabless, Foundry, Memory, and OSAT, with a focus on the Asia-Pacific and China markets. Additionally, he oversees SEMI’s MIT partnerships worldwide.
Clark has held several strategic and analytical roles in leading companies in the microelectronics sector before joining SEMI. At Mediatek, he was the Deputy Director of Computing, Connectivity, and Metaverse Business Group. There, he provided market intelligence and competitive analysis for Computing (HPC/ASIC), Connectivity (5G/Wi-Fi) and Multimedia (XR and Auto) domains. Clark has also worked as the division manager of Strategy and Business Development at Qimonda, where he managed market & competitive intelligence functions in the Asia/Pacific region. Before that, he was an analyst at IDC, covering semiconductor, flat panel display, and telecommunication markets.